11 – 12 July, 2019 San Francisco | CEI Modular Booth #12
CEI Modular: Paving the Way for Modular Data Center Deployment
Faster, Stronger and Cooler – Now with Direct-on-Chip Waterless Liquid Cooling
At booth #12 learn more about how CEI Modular designs, builds, tests and delivers comprehensive solutions through to commissioning and maintenance. On display will be ZutaCore’s direct-on-chip, two-phase change, waterless liquid cooling solution. Utilizing ZutaCore’s HyperCool2™ system, CEI Modular is speeding delivery of higher quality modular solutions that can densify data centers and provide faster return on investment.
Event Page: https://www.datacenterdynamics.com/conferences/san-francisco/2019/